Cystron  technology  limited

 Cystron Technology Limited

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  • In the third quarter, NAND Flash brand revenue increased

    With the maturity of 64/72-layer 3D NAND production and the continued increase in supply, the NAND Flash supply grew steadily in the third quarter. However, the demand side was affected by the trade friction between China and the United States, and the lack of Intel CPUs and the sales of Apple's new machines were not as expected. Since the beginning of the year, the oversupply is still difficult to eliminate. The contract price of various products of NAND Flash is still falling. The average price in the third quarter has dropped by 10-15%.

    Looking forward to the fourth quarter, as the European and American festival stocks have been substantially completed, the module factory and various OEMs control the inventory, and the Sino-US trade friction continues, resulting in continued weakening of the demand, it is expected that the fourth quarter will still maintain the oversupply situation, the contract price of various products The decline has intensified. In order to maintain gross profit and reduce inventory, it is expected that the price competition in the Enterprise SSD and Wafer markets will become more intense.

    Samsung Electronics (Samsung)

    Although overall demand is not as expected, with the help of the flagship smartphone market and the continued growth of server and PC SSD shipments, Samsung's third-quarter shipments still showed more than 20% quarterly growth. However, as prices continued to weaken, the average unit price fell by nearly 15%. The third quarter revenue was $6.05 billion, up 2.1% from the previous quarter. From process and capacity analysis, Samsung has adopted the fifth-generation process in consumer SSD products and will gradually import it into PC SSD and mobile device UFS. However, due to the oversupply situation, Samsung will slow down the progress of the fifth-generation process, and the output of the 2019 is still based on the 64/72 layer process.

    SK Hynix

    Driven by smartphone shipments and SSD sales growth, SK Hynix's shipments still maintained a 19% quarterly growth in the third quarter. However, demand was not as good as expected, and the oversupply situation could not be reversed, resulting in an average sales unit price drop of 10%. %, the overall revenue came to 1.83 billion US dollars, up 6.0% from the previous quarter. In terms of product mix, SK Hynix's sales focus is on the mobile device market. With the launch of Apple's new machine and the launch of the full-screen concept mobile phone by Chinese manufacturers, and the introduction of higher-standard products, the performance of 128GB and above capacity shipments is bright, and the shipment of the unit is growing steadily. In addition, with the help of 72-layer NAND Flash products, this season's SSD shipments also accounted for more than 20%.

    Toshiba memory (Toshiba)

    Also benefiting from the continued increase in capacity of Apple's new machine and Chinese smartphone makers, Toshiba's memory has maintained a quarterly shipment growth of more than 20% in the third quarter. However, under the influence of the continued decline in the price of end products, the average The unit price of sales has dropped by nearly 15%, resulting in an overall revenue of $3.2 billion, an increase of 1.9% from the previous quarter. From the perspective of process and capacity, 64-layer 3D NAND output has accounted for more than 70%, and 3D NAND investment has officially exceeded 50%. The 2019 expansion will focus on Fab 6's new capacity, but consider To the market oversupply and process maturity, the first 64 layers will be the main production process.

    Western Digital

    In addition to maintaining the advantages of retail and channel market business in the third quarter, Western Digital began to officially ship high-capacity UFS products and achieved good performance in the SSD market through preferential prices. The quarterly shipments grew by 28%, but Affected by the decline in prices of various products, the average sales unit price fell 16%, the overall revenue came to 2.534 billion US dollars, up 7.0% from the previous quarter. From the perspective of capacity planning, in response to the oversupply of NAND Flash in 2018, Western Digital is expected to control production capacity and capital expenditures. Therefore, the expansion of the first half of the year and the transition to 96-layer 3D NAND will slow down slightly.

    Micron

    Benefiting from the peak season effect of smartphones and the growth of SSD sales, Micron's third-quarter shipments grew by more than 25%. Micron still has an important influence in the channel market. Under the situation that the price of the channel market is deep, the average selling price of this quarter has dropped by nearly 15%. The overall revenue reached US$2.23 billion, up 14.7% from the previous quarter. In terms of product portfolio, Micron is committed to reducing the proportion of channels in the channel market, focusing on new NVMe and QLC architecture SSD products to meet the needs of high-performance and high-capacity markets. In the mobile device market, Micron has continued to cooperate with Chinese suppliers and has officially mass-produced shipments in the third quarter.

    Intel (Intel)

    Through long-term efforts in the server SSD market, Intel's third-quarter shipments still have more than 10% growth. Despite the current decline in the NAND Flash market, Intel's average sales unit price fell only over 9%, and overall revenue remained at $1.08 billion, roughly the same as the previous quarter. However, profitability is the best season of the year, mainly because more than half of the SSDs shipped in the third quarter are equipped with 64-layer 3D NAND components, further reducing costs. In terms of production capacity, the capacity of the second phase of the Dalian plant is expected to be fully loaded in the first half of 2019. In addition, the relationship between Intel and Micron in the field of non-volatile storage has come to an end. But Intel will still get the required 3D XPoint output from the IMFT plant by at least 2020. In addition to developing third-generation products on their own, they are also studying the plans for self-production.
     


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